tsc Plasma


Injection Moulding

Injection Moulding

  • Step 1: Injection moulding with different kinds of materials

    The material of LASER DIRECT STRUCTURE is special, and different proportions of metal powder and adhesive will be mixed into the material. Usually common materials are provided, such as PC, PC+ABS, LCP, NYLON, etc.

Laser etching

Laser etching on plastic part.

  • STEP 2: metallization

    Use a patented laser etching machine to etch out the designed circuit. Usually this step can be called metallization. The principle is to use a laser to etch away the plastic on the surface of the material, so that the metal components wrapped in the plastic can be revealed.

Electroless Plating

Electroless Plating

  • STEP 3: Electroless Plating

    In this process, the metallized materials are immersed in chemical potions, which are copper, nickel, and gold. The immersion time of each potion is proportional to the thickness of the circuit. After the chemical plating is completed, after several times of pure water cleaning, the material is completely free of potion residue, and then placed in the oven to dry.



  • Step 4: Screen printing or dispensing solder paste

    After completing the LDS (Laser direct structure), the antenna part is completed.

    But if you need to solder ICs or resistors or capacitors, you need to put the solder paste on the designed position. There are usually two ways, using a high-precision glue dispenser or printing with a steel plate.

Beater and reflow oven

Mounter and reflow oven

  • Step 5: Mounting and reflow

    To quickly place the electronic components in the design position requires a high speed parting machine, usually the reflow oven will be followed by the conveyor belt. This completes the entire LDS process.